The Nano FAB Center consists of three independent clean room subareas (Fab1, Fab2, Fab3) with class 100 to 10000 and two Nanolabs:
Electrical and optical characterization of devices NanoLab
Packaging NanoLab (wafer/chip bonding, wire bonding, die saw and more).
Advanced cutting-edge Nano-Fabrication equipment is used in all our labs and FABs, and enables us to offer a comprehensive service, from concept to product.
- ✔ Thin film deposition
- ✔ Etching
- ✔ Lithography
- ✔ Bonding
- ✔ Baking
- ✔ Dicing & polishing
- ✔ Mask Fabrication and wafers cleaning
- ✔ Devices analysis and characterization
