The Nano-Fabrication Center

E-gun VST

E-GUN VST

E-beam evaporation is a process similar to thermal evaporation i.e. a source material is heated above its boiling/sublimation temperature and evaporated to form a film on the surfaces that is stroke by the evaporated atoms. This evaporation method has just like thermal evaporation a pore ability to cover steps which also makes this method ideal for lift-off processes. A noticeable advantage of e-beam evaporation over thermal evaporation is the possibility to add a larger amount of energy into the source material. This yields a higher density film with an increased adhesion to the substrate. Because the electron beam only heats the source material and not the entire crucible, a lower degree of contamination from the crucible will be present than in the case of thermal evaporation. By using a multiple crucible E-beam gun, several different materials can be deposited without breaking the vacuum.

The E-beam evaporation process:

With the source material placed in the crucible a filament below the crucible is heated. By applying a large voltage, electrons are drawn from the filament and focused as a beam on the source material by several bending magnets. The beam is swept across the surface of the source material to heat all of the material.

E-GUN vst.JPG
Features:

✔ Crucible with six pockets-for 6 different materials.

✔ Automatic Load –Lock for loading samples-up to 4 inch wafer.

✔ Maximum power 6 kW.

✔ Estimated distance between electron beam gun crucible and chamber top – 1100 mm.

✔ High-grade stainless steel 304(L), non-magnetic D-shape box.

✔ Dimensions are 450(W) x475(D) x 1200(H).

✔ XY beam sweep control with selectable triangular or sinusoidal waveforms, oscillating circle pattern or rotating line. Programmable center and sweep limits. It stores up to eight sweep patterns which can be remotely selected. Includes hand held remote joy stick control.

o Frequency range: 0.1 to 100Hz

o Coil current: +/-1.7A max.

o Rotational resolution: 1deg.

✔ High end Quartz Crystal Deposition Controller, TFITELEMARK Model 880, is based on a multimicroprocessordesign, which enables rapid measurement updates with superior resolution, as well as modular architecture.

VST work protocol+manual.pdf

instruction manual - digital sweep.pdf

Manual Telemark.pdf

E-gun

E-beam evaporator-ODEM

E-beam evaporation is a process similar to thermal evaporation i.e. a source material is heated above its boiling/sublimation temperature and evaporated to form a film on the surfaces that is stroke by the evaporated atoms. This evaporation method has just like thermal evaporation a pore ability to cover steps which also makes this method ideal for lift-off processes. A noticeable advantage of e-beam evaporation over thermal evaporation is the possibility to add a larger amount of energy into the source material. This yields a higher density film with an increased adhesion to the substrate. Because the electron beam only heats the source material and not the entire crucible, a lower degree of contamination from the crucible will be present than in the case of thermal evaporation. By using a multiple crucible E-beam gun, several different materials can be deposited without breaking the vacuum.

The E-beam evaporation process:

With the source material placed in the crucible a filament below the crucible is heated. By applying a large voltage, electrons are drawn from the filament and focused as a beam on the source material by several bending magnets. The beam is swept across the surface of the source material to heat all of the material.

Odem Electron Beam Evaporation Systems

Come in a dual chamber configuration consisting of the main chamber for housing the two e-beam sources and load lock chamber. This configuration with a gate valve between two chambers may be used as a load lock to keep the e-beam source pockets in vacuum while substrate is loaded and unloaded from the main chamber substrate holder or platen. Co-evaporation capability with rotatable multi-pocket source and wafer holder ability to program compositions or compositional gradients through PC control can be provided.

Features:

• Sequential or Co-Evaporation up to 8 materials.

• Two E-Guns

• Rotatable Multi-Pocket Source

• Programmable Beam Scan

• 10 KW Switching Power Supply

• Turbomolecular Pump, 10-7 mBar

• Manual Load/Unload

• Auto Load/Unload with Load Lock

• Crystal Thickness Monitor

E-gun manual.pdf

MAXTEK manual.pdf

Thermal

Thermal-ODEM

The thermal evaporation is one of the simplest of the thin film deposition techniques. The source material (in the form of pellets, shots) is placed in a vacuum chamber on resistance heated metal boats or ceramic crucible heated until its surface atoms have sufficient energy to leave the surface. At this point they will traverse the vacuum chamber, at thermal energy (less than 1 eV), and coat a substrate positioned above the evaporating material. The pressure in the chamber must be below the point where the mean free path is longer than the distance between evaporation source and the substrate. The mean free path is the average distance an atom or molecule can travel in a vacuum chamber before it collides with another particle thereby disturbing its direction to some degree. This is typically 2.0 x 10-6 m Bar or lower.

The Odem 700/3 Thermal Evaporation System is a high vacuum system equipped with a turbo molecular pump and a mechanical backing pump which is capable of depositing one to three metals, either simultaneously or in layers. The thickness of each layer can be controlled down to the nanometer scale by utilizing quartz crystal micro balance.

System Specifications

· Thin films of titanium, palladium and gold, can be deposited with the Odem thermal evaporator. The maximum film thickness allowed for each deposition are 500 nm Ti and Pd , and 2 um Au.

· Ultimate chamber pressure 5x10-7mbar.

· Substrate sizes up to5"x5".

· The substrate temperature can be controlled in range 40 -90º C with water chiller.

Thermal manual.pdf

MAXTEK manual.pdf

Sputtering

Sputtering-ODEM

Description

Sputtering is a Plasma Vapor Deposition (PVD) process in which plasma is created and positively charged ions from the plasma are accelerated by an electrical field superimposed on the negatively charged electrode or "target". The positive ions are accelerated by potentials ranging from a few hundred to a few thousand electron volts and strike the negative electrode with sufficient force to dislodge and eject atoms from the target. These atoms will be ejected in a typical line-of-sight cosine distribution from the face of the target and will condense on surfaces that are placed in proximity to the sputtering cathode.

The targets are fabricated from materials that one subsequently wishes to deposit on the surface of the component facing the electrode. Conductive materials can be deposited using a direct current (DC) power supply and insulators can be deposited by using a radio frequency (RF) power supply. 13.56 MHz is one of the frequencies in the RF spectrum that has been allocated to “industrial applications" as is by far the most common frequency used in the sputtering application.

Magnetron sputtering (use with DC or RF) deposition uses a closed magnetic field to trap electrons, enhancing both the efficiency of the initial ionization process and allowing plasma to be generated at lower pressures which reduces both background gas incorporation in the growing film and energy loses in the sputtered atom through gas collisions.

Odem Sputter system for R&D Application based on magnetron sputtering principle allows to deposition of various metals and insulators.

System Specifications

· Substrate sizes up to5"x5".

· Two 2" RF guns and one 2" DC gun

· Ultimate pressure: 5x10-7 mbar.

· Introducing gass system: Two mass flow controllers.

· Deposition materials: Au,Ti, Cr, TiN, TiO2,Cr, SiO2, Mg F2, and others.

CVD

CVD / LPCVD Expertech

Description

Two high temperature compact reactors CTR 125 provide both atmospheric pressure (CVD) and Low vacuum (LPCVD) chemical vapor deposition processes.

The CVD system is used for silicon oxide (SiO2) films on silicon wafer by means of its diffusion.

The LPCVD system is used for deposit of amorphous- or poly- silicon on substrates.

Specifications / Capabilities

Production style performance in a small footprint;

Fully automated, recipe driven processing.

LPCVD & CVD up to 4” wafer size and 25wafers in one cycle

Applications

✔ Thermal Oxide or Silicon Dioxide (SiO2) is the insulating layer commonly used in semiconductors.

✔ Amorphous silicon (a-Si) is the non-crystalline form of Si used for solar cells and thin film transistors in LCD displays.

✔ Solar cells, MEMS etc…

Link

http://www.exper-tech.com/

http://www.exper-tech.com/products/compact-thermal-reactor/

Spray Coating

Spray Coater : Sono-Tek ExactaCoat

Description:

The ExactaCoat is a fully-enclosed programmable 3-axis robot that is ideal for any spray coating application. This system employs robust ball-screw slides driven by brushless DC servo motors. Sono-Tek ultrasonic nozzles are easily integrated. Spray pattern widths can be easily shaped depending on which nozzle is used. Ideal for R&D, the ExactaCoat is easily configured with Sono-Tek ultrasonic nozzles to customize spray patterns for your specific application. Patterns are easily shaped, ranging from 0.08 - 6" wide (2 - 153 mm). Several liquid delivery options are available with a wide range of flow rate capabilities.

Spray Coating.jpg

The ExactaCoat includes many integrated features:

• 400 mm x 400 mm x 100 mm (15.75" x 15.75" x 3.94") range of motion

• Windows®-based programming software with image import (PC included)

• Remote trackball teach pendant

• Coordinated motion in all three axes simultaneously

• Reduced wasteful overspray and atmospheric contamination

• Precise, repeatable spray patterns are easily shaped

• Highly controllable spray produces reliable, consistent results

Material:

A variety of materials can be coated using ultrasonic nozzles on flat or topographic surfaces, such as:

✔ Photoresists

✔ Nanoparticles

✔ Nanotubes

Viscosity upper limit: 50 cps

Solid concentration upper limit: 40%

Sono-Tek ultrasonic nozzles can create a variety of precise spray patterns:

spray coating 2.JPG

http://www.sono-tek.com/products

Spray Coater- manual.pdf